专利名称：Semiaromatic polyamide resin composition发明人：Ogo, Yoshimasa,Amimoto, Yoshikatsu申请号：EP98104476.1申请日：19980312公开号：EP0864610A1公开日：19980916
摘要：A semiaromatic polyamide resin composition of the present invention contains apolyamide (A) in which a dicarboxylic acid component unit comprises a terephthalic acidcomponent unit and a diamine component unit comprises a straight-chain
alkylenediamine component unit and an alkylenediamine component unit having a side-chain alkyl group; and a modified ethylene/α-olefin copolymer (B) obtained by graft-modifying an ethylene/α-olefin copolymer having particular properties with anunsaturated carboxylic acid or a derivative thereof. A molded article obtained by usingthis composition exhibits excellent anti-creeping property under high-temperature andhigh-humidity conditions, and causes the metal mold to be little fouled during themolding operation.
申请人：MITSUI CHEMICALS, INC.
地址：2-5, Kasumigaseki 3-chome, Chiyoda-ku Tokyo JP
国籍：JP
代理机构：Hansen, Bernd, Dr. Dipl.-Chem.
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