专利名称：Method and device for reflow-soldering and
reflow-desoldering of printed circuit boards
发明人：EHLER, HELMUT, ING.申请号：EP87109260.7申请日：19870627公开号：EP0251257B1公开日：19940119
摘要：process for reflow soldering. - entl\öten of leiter\platten by meansof infrared radiation from the radiator group in an oven. the circuit boards are in a bandor werkst\ücktr\äger graphics in the furnace and while the vorw\ärm,soldering or entl\öt and cooling has stopped moving.the preheating of a firstspecified time, the radiator group with reduced betriebs\strom holdings. thereflow soldering. - entl\öten the betriebstrom the radiator group for a secondspecified time to a high predetermined level and then it switched off. the gel\ötetenorentl\öteten pcbs in laminar flow of air fans for the suction of the
l\ötd\ämpfe chilled. the fans begin to solidify the lots with reduced speed, andthen filled with dreh\zahl holdings. subsequently, the circuit boards from thefurnace.
申请人：DEUTSCHE AEROSPACE AG,DEUTSCHE AEROSPACE,DEUTSCHE AEROSPACE AG
地址：D-81663 MUENCHEN,DE,D-81663 MUENCHEN
国籍：DE
代理机构：Schulze, Harald Rudolf, Dipl.-Ing.
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