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Chemical vapor deposition method using a plasma se

2024-10-18 来源:威能网
专利内容由知识产权出版社提供

专利名称:Chemical vapor deposition method using a

plasma self-cleaning

发明人:Atsuhiro Tsukune,Kenji Koyama申请号:US07/490887申请日:19900309公开号:US05041311A公开日:19910820

摘要:A CVD method comprises the steps of making a plasma self- cleaning within achamber using a gas which includes fluorine, coating an inside of the chamber by a firstlayer of a material which includes silicon and nitrogen, and forming a second layer on apredetermined surface within the chamber by a chemical vapor deposition. The secondlayer is made of a material which includes a quantity of nitrogen smaller than a quantityof nitrogen included in the first layer.

申请人:FUJITSU LIMITED

代理机构:Armstrong, Nikaido, Marmelstein, Kubovcik & Murray

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