专利名称：Heat treating method and heat treating
apparatus
发明人：Hideaki Sakurai,Shinichi Ito,Iwao
Higashikawa,Akitoshi Kumagae
申请号：US10282114申请日：20021029
公开号：US20030052119A1公开日：20030320
专利附图：
摘要：Disclosed is a heat treating method for heating a target substrate by means oflight irradiation, in which a light irradiation treatment is applied to the target substrate a
plurality of times such that adjacent light irradiated regions on the target substratepartially overlap with each other and that the adjacent light irradiated regions do notoverlap with each other in the light irradiating periods.
申请人：KABUSHIKI KAISHA TOSHIBA
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