专利名称：Dual metal stud bumping for flip chip
applications
发明人：Rajeev Joshi,Consuelo Tangpuz,Margie T.
Rios,Erwin Victor R. Cruz
申请号：US11404650申请日：20060414公开号：US07501337B2公开日：20090310
专利附图：
摘要：A method for forming a stud bumped semiconductor die is disclosed. Themethod includes forming a ball at the tip of a coated wire passing through a hole in a
capillary, where the coated wire has a core and an oxidation-resistant coating. The formedball is pressed to the conductive region on the semiconductor die. The coated wire is cut,thereby leaving a conductive stud bump on the conductive region, where the conductivestud bump includes an inner conductive portion and an outer oxidation-resistant layer.
申请人：Rajeev Joshi,Consuelo Tangpuz,Margie T. Rios,Erwin Victor R. Cruz
地址：Cupertino CA US,Lapulapu PH,Mandaue PH,Koronadal PH
国籍：US,PH,PH,PH
代理机构：Townsend and Townsend and Crew LLP
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